MBRS230LT3
http://onsemi.com
4
PACKAGE DIMENSIONS
SMB
PLASTIC PACKAGE
CASE 403A?03
ISSUE D
A
S
D
B
J
P
K
C
H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN
DIMENSION P.
DIM MIN MAX MIN MAX
MILLIMETERS
INCHES
A
0.160 0.180 4.06 4.57
B
0.130 0.150 3.30 3.81
C
0.075 0.095 1.90 2.41
D
0.077 0.083 1.96 2.11
H
0.0020 0.0060 0.051 0.152
J
0.006 0.012 0.15 0.30
K
0.030 0.050 0.76 1.27
P
0.020 REF 0.51 REF
S
0.205 0.220 5.21 5.59
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*

mm
inches
SCALE 8:1
2.743
0.108
2.159
0.085
2.261
0.089
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e changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
aTypicalo parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including aTypicalso must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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MBRS230LT3/D
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